IC Chip CPU Blade Motherboard PCB Thin Blade Glue Remover for iPhone Mobile Phone IC Repair Tool

IC Chip CPU Blade Motherboard PCB Thin Blade Glue Remover for iPhone Mobile Phone IC Repair Tool
  • Sellermakestyle.us
  • List PriceUS$17.88piece
  • Sale PriceUS$17.88piece
  • ShippingFree Shipping
  • Ratings3,5 (292)

Product Description

Features :

Unique teeth tips design.
0.15mm tips.
Anti-over press buckle.
Non-slip handle.

Special precision parts maintenance, microscope operation, replacement of computer parts, mobile phone assembly, such as BGA PAD STENCILS for soldering.

Specification :

A
Short handle-Straight
Model: TS-11
Size: 107*6.6mm

B
Long handle-Straight
Model: TB-11
Size: 140*7.2mm

C
Short handle-Bend
Model: TS-15
Size: 106*6.6mm

D
Long handle-Bend
Model: TB-15
Size: 140*7.2mm

Package includeds :

1 x 0.15mm Jump Wire Tweezers (4 types for Optional~)
Details pictures :

MECHANIC Maintenance Tweezers Bend Straight 0.15mm Stainless Steel BGA Motherboard Jump Wire Tweezer

MECHANIC Maintenance Tweezers Bend Straight 0.15mm Stainless Steel BGA Motherboard Jump Wire Tweezer

MECHANIC Maintenance Tweezers Bend Straight 0.15mm Stainless Steel BGA Motherboard Jump Wire Tweezer

MECHANIC Maintenance Tweezers Bend Straight 0.15mm Stainless Steel BGA Motherboard Jump Wire Tweezer

MECHANIC Maintenance Tweezers Bend Straight 0.15mm Stainless Steel BGA Motherboard Jump Wire Tweezer

MECHANIC Maintenance Tweezers Bend Straight 0.15mm Stainless Steel BGA Motherboard Jump Wire Tweezer

MECHANIC Maintenance Tweezers Bend Straight 0.15mm Stainless Steel BGA Motherboard Jump Wire Tweezer

MECHANIC Maintenance Tweezers Bend Straight 0.15mm Stainless Steel BGA Motherboard Jump Wire Tweezer

MECHANIC Maintenance Tweezers Bend Straight 0.15mm Stainless Steel BGA Motherboard Jump Wire Tweezer

MECHANIC Maintenance Tweezers Bend Straight 0.15mm Stainless Steel BGA Motherboard Jump Wire Tweezer

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